508.8 FUNGUS CONTENTS
| Paragraph | Page | |
|---|---|---|
| 1. | SCOPE | |
| 1.1 | PURPOSE | 1 |
| 1.2 | APPLICATION | 1 |
| 1.3 | LIMITATIONS | 1 |
| 2. | TAILORING GUIDANCE | 1 |
| 2.1 | SELECTING THE FUNGUS METHOD | 1 |
| 2.1.1 | EFFECTS OF FUNGUS GROWTH | 2 |
| 2.1.1.1 | DETRIMENTAL EFFECTS | 2 |
| 2.1.1.2 | PHYSICAL INTERFERENCE | 2 |
| 2.1.1.3 | HEALTH AND AESTHETIC FACTORS | 2 |
| 2.1.2 | SEQUENCE AMONG OTHER TEST METHODS | 3 |
| 2.2 | SELECTING PROCEDURE VARIATIONS | 3 |
| 2.2.1 | TEST DURATION | 3 |
| 2.2.2 | CHOICE OF FUNGUS | 3 |
| 3. | INFORMATION REQUIRED | 3 |
| 3.1 | PRETEST | 3 |
| 3.2 | DURING TEST | 4 |
| 3.3 | POST-TEST | 5 |
| 4. | TEST PROCESS | 5 |
| 4.1 | TEST FACILITY | 5 |
| 4.1.1 | TEST CHAMBER | 5 |
| 4.1.2 | SENSORS | 5 |
| 4.1.3 | AIR VELOCITY | 5 |
| 4.1.4 | DECONTAMINATION | 5 |
| 4.2 | CONTROLS | 6 |
| 4.2.1 | RELATIVE HUMIDITY | 6 |
| 4.2.2 | CIRCULATION | 6 |
| 4.2.3 | STEAM | 6 |
| 4.2.4 | UNLESS OTHERWISE SPECIFIED | 6 |
| 4.3 | TEST INTERRUPTION | 6 |
| 4.3.1 | INTERRUPTION DUE TO CHAMBER MALFUNCTION | 6 |
| 4.3.2 | INTERRUPTION DUE TO TEST ITEM OPERATION FAILURE | 7 |
| 4.4 | TEST EXECUTION | 7 |
| 4.4.1 | CLEANING | 7 |
| 4.4.2 | MISCELLANEOUS | 7 |
| 4.4.3 | PREPARATION FOR TEST | 8 |
| 4.4.3.1 | PREPARATION FOR MINERAL SALTS SOLUTION | 8 |
| 4.4.3.2 | PREPARATION FOR MIXED SPORE SUSPENSION | 8 |
| 4.4.3.3 | CONTROL ITEMS | 9 |
| 4.5 | TEST PROCEDURE | 10 |
| 4.5.1 | PREPARATION FOR INCUBATION | 10 |
| 4.5.2 | INCUBATION OF THE TEST ITEM | 11 |
MIL-STD-810H METHOD
508.8 CONTENTS - Continued
| Paragraph | Page | |
|---|---|---|
| 4.5.3 | INSPECTION | 11 |
| 4.5.4 | OPERATION/USE | 11 |
| 4.6 | DECONTAMINATION | 11 |
| 5. | ANALYSIS OF RESULTS | 11 |
| 6. | REFERENCE/RELATED DOCUMENTS | 12 |
| 6.1 | REFERENCED DOCUMENTS | 12 |
| 6.2 | RELATED DOCUMENTS | 12 |
| TABLES | ||
| TABLE 508.8-I. | US TEST FUNGUS | 4 |
| TABLE 508.8-II. | EVALUATION SCHEME FOR VISIBLE EFFECTS | 12 |
METHOD
508.8 ANNEX A DECONTAMINATION OF TEST EQUIPMENT AND TEST ITEMS AFTER EXPOSURE TO FUNGUS
METHOD
508.8 ANNEX B
FUNGUS-INERT MATERIALS
TABLE
TABLE 508.8B-I. FUNGI SUSCEPTIBILITY OF MATERIALS B-1
MIL-STD-810H
METHOD 508.8
METHOD
508.8 FUNGUS
NOTE: Tailoring is essential. Select methods, procedures and parameter levels based on the tailoring process described in Part One, paragraph 4.2.2, and Annex C. Apply the general guidelines for laboratory test methods described in Part One, paragraph 5 of this Standard.
508.8 ANNEX A
METHOD 508.8, ANNEX A DECONTAMINATION OF TEST EQUIPMENT AND TEST ITEMS AFTER EXPOSURE TO FUNGUS
-
Decontamination of test equipment, materials, and test items that have been subjected to a fungus test is paramount when the test items are to be sent back to the users, manufacturer, or material management office for further evaluation or reuse. Many test items are too expensive to scrap and must be decontaminated.
-
Decontamination and disinfection of the test chamber.
- a. Initially, good housekeeping procedures should be followed for all testing, especially those tests involving live cultures.
- b. Prior to any testing, the climatic chamber should be thoroughly cleaned inside with a hot, soapy water (or Lysol®-type, parachlorometaxylenol or other microbial decontaminant cleaner) solution.
- c. With no items in chamber, apply high heat (at least 60 °C (140 °F)) and humidity (greater than 90 percent RH) for at least 2 hours. Dry the chamber at 60 °C (140 °F) with no humidity prior to cooling the chamber to ambient. Place the test items in the chamber for fungus testing.
- d. After testing is complete and the items have been examined/pictures taken, the items and the chamber can be initially sterilized with high heat as above and at least 90 percent relative humidity for at least 2 hours. The humidity keeps the surfaces wet until the spores are destroyed.
NOTE: The test items must be able to withstand the high temperature chosen for initial sterilization without damage. Check the test item user's manual for the storage temperature before proceeding. If the heat is less than 40 °C (104 °F), a longer decontamination time will be needed (up to several days).
Alternatively, the chamber can be washed with a sodium or calcium hypochlorite solution at 5000 ppm concentration (wear appropriate personal protective equipment (PPE) when using any chemical solutions). A phenolic disinfectant spray can also be used and a Lysol®-type solution will also help control microbial growth. Copious flushing with water to rinse the chamber is needed to limit the chlorine contact on the metal surfaces.
- e. If the test items are washable, follow the instructions for each item and launder in a machine, if possible.
- f. If the items cannot be washed with a solution, wipe with a damp cloth that has been sprayed with a phenolic solution (disinfectant spray) and label the items appropriately with precautions on handling items that have been subjected to fungus testing. Personnel trained in microbiological techniques and who conduct these tests should have general operating procedures in place for handling fungus cultures and test items after exposure.
- g. Perform chamber disinfection after each fungus test. This will ensure a clean test chamber is used, and will help eliminate fungus spores from contaminating the next test. Be sure to disinfect all surfaces and hangers used during testing as well.
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MIL-STD-810H METHOD 508.8 ANNEX A
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MIL-STD-810H
METHOD 508.8 ANNEX B METHOD 508.8, ANNEX B FUNGUS-INERT MATERIALS
(See paragraph 6.1, reference d)
NOTE: Although the basic (documented) resistance of materials to fungal growth shown below is helpful in the design of new materiel, it is unreliable in determining the fungal susceptibility of complex materials, and the use of testing by analysis is discouraged. The combination of materials, the physical structure of combined materials, and the possible contamination of resistant materials during manufacture is beyond the purview if superficial analysis, and necessitates laboratory or natural environment tests to verify the resistance of the assembled materiel to fungal growth. Caution: The below Table is not a comprehensive list and does not necessarily reflect modern day formulations of materials.
| Group I - Fungus-inert materials (Fungus-inert in all modified states and grades) | |
|---|---|
| Acrylics | Polyamide¹ |
| Acrylonitrile-styrene | Polycarbonate |
| Acrylonitrile-vinyl-chloride copolymer | Polyester-glass fiber laminates |
| Asbestos | Polyethylene, high density (above 0.940) |
| Ceramics | Polyethylene terephthalate |
| Chlorinated polyester | Polyimide |
| Flourinated ethylenepropylene copolymer (FEP) | Polymonochlorotrifluoroethylene |
| Glass | Polyporpylene |
| Metals | Polystyrene |
| Mica | Polysulfone |
| Plastic laminates: | Polytetrafluoroethylene |
| Silicone-glass fiber | Polyvinylidene Chloride |
| Phenolic-nylon fiber | Silicone resin |
| Diallyl phthalate | Siloxane-polyolefin polymer |
| Polyacrylonitrile | Siloxane polystyrene |
Group II - Fungus nutrient materials (May require treatment to attain fungus resistance)
| ABS (acrylonitrile-butadiene-styrene) | Polydichlorostyrene |
| Acetal resins | Polyethylene, low & medium density (0.940 and below) |
| Cellulose acetate | Polymethyl methacrylate |
| Cellulose acetate butyrate | Polyurethane (ester types are particularly susceptible) |
| Epoxy-glass fiber laminates | Polyricinoleates |
| Epoxy-resin | Polyvinyl chloride |
| Lubricants | Polyvinyl chloride-acetate |
| Melamine-formaldehyde | Polyvinyl fluoride |
| Organic polysulphides | Rubber, natural and synthetic |
| Phenol-formaldehyde | Urea-formaldehyde |
NOTE: 1. Literature shows that, under certain conditions, polyamides may be attacked by selective micro-organisms. However, for military applications, they are considered Group I.
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MIL-STD-810H METHOD 508.8 ANNEX B
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METHOD 509.7
SALT FOG CONTENTS
| Paragraph | Page | |
|---|---|---|
| 1. | SCOPE | 1 |
| 1.1 | PURPOSE | 1 |
| 1.2 | APPLICATION | 1 |
| 1.3 | LIMITATIONS | 1 |
| 2. | TAILORING GUIDANCE | 1 |
| 2.1 | SELECTING THE SALT FOG METHOD | 1 |
| 2.1.1 | EFFECTS OF CORROSIVE ENVIRONMENTS | 1 |
| 2.1.1.1 | CORROSION EFFECTS | 2 |
| 2.1.1.2 | ELECTRICAL EFFECTS | 2 |
| 2.1.1.3 | PHYSICAL EFFECTS | 2 |
| 2.1.2 | EFFECTS OF CORROSIVE ENVIRONMENTS | 2 |
| 2.2 | SELECTING PROCEDURE VARIATIONS | 2 |
| 2.2.1 | SALT SOLUTION | 2 |
| 2.2.2 | TEST ITEM CONFIGURATION | 2 |
| 2.2.3 | DURATION | 2 |
| 2.2.4 | TEMPERATURE | 3 |
| 2.2.5 | AIR CIRCULATION | 3 |
| 2.2.6 | FALLOUT RATE | 3 |
| 2.2.7 | DRYOUT RATE | 3 |
| 3. | INFORMATION REQUIRED | 3 |
| 3.1 | PRETEST | 3 |
| 3.2 | DURING TEST | 3 |
| 3.3 | POST-TEST | 3 |
| 4. | TEST PROCESS | 4 |
| 4.1 | TEST FACILITY | 4 |
| 4.1.1 | TEST CHAMBER | 4 |
| 4.1.2 | SALT SOLUTION RESERVOIR | 4 |
| 4.1.3 | SALT SOLUTION INJECTION SYSTEM | 4 |
| 4.1.4 | SALT FOG COLLECTION RECEPTACLES | 5 |
| 4.2 | CONTROLS | 5 |
| 4.3 | TEST INTERRUPTION | 5 |
| 4.3.1 | TEST INTERRUPTION. DUE TO CHAMBER MALFUNCTION. | 5 |
| 4.3.2 | TEST INTERRUPTION DUE TO TEST ITEM OPERATION FAILURE. | 6 |
| 4.4 | TEST SETUP | 6 |
| 4.5 | TEST EXECUTION | 6 |
| 4.5.1 | PREPARATION FOR TEST | 6 |
| 4.5.1.1 | PRELIMINARY STEPS | 6 |
| 4.5.1.2 | PRETEST STANDARD AMBIENT CHECKOUT. | 8 |
| 4.5.2 | PROCEDURE | 9 |
| 5. | ANALYSIS OF RESULTS | 9 |