The MUA package shall include all technical information required to justify the application. MUAs for stress corrosion shall include a Stress Corrosion Cracking Evaluation per MSFC-STD-3029, section 5.4.
13.3 CONTENTS:
The parts list or MIUL shall identify the following applicable information:
- Detail drawing and dash number
- Next assembly and dash number
- Change letter designation
- Drawing source
- Material form
- Material manufacturer
- Material manufacturer's designation
- Material specification
- Process specification
- Environment
- Weight (nonmetallic materials)
- MAPTIS Material Code (if data are to be provided in a form compatible with MAPTIS)
- Standard/commercial part number
- Contractor
- System
- Subsystem
- Maximum operating temperature
- Minimum operating temperature
- Fluid type
- Surface area (nonmetallic materials)
- Associate contractor number
- Project
- Document title
- Criticality
- Line number
- Overall evaluation
- Overall configuration test
- Maximum operating pressure
- Minimum operating pressure
- MUA number or rationale code
- Cure codes
- Materials rating
- Remarks (comments field)
13.3 CONTENTS:
The FOD Control Plan shall address the following elements:
- a. Identification of probable FOD sources.
- b. Early design considerations for FOD prevention, resistance to damage, foreign object entrapment, etc.
- c. Manufacturing planning for minimizing FOD generation and cleaning up whatever FOD is generated.
- d. FOD control methods.
- e. FOD Awareness and Prevention Training.
- f. Metrics - Measuring techniques for analysis, trending, and feedback.
- g. Incident investigation/reporting, "lessons learned."
- h. Awareness/Employee Feedback.
The contractor shall define cleanliness level acceptance limits and verification methods for fluid systems and for general spaceflight hardware internal and external surfaces. The contractor shall also provide a list identifying all system fluids, together with the fluid specifications (for procurement or custom mixing) and the required cleanliness levels for the fluid system.
13.3
CONTENTS:
NDE Specifications and Standards – The NDE Plan shall address the selection and the order of precedence of applicable government, industry, and prime contractor NDE specifications and standards and how the requirements contained therein are implemented through internal procedures and how-to documents. The oversight of subcontractor implementation and flow down of the NDE requirements shall also be addressed. The Plan shall address commonly used aerospace industry NDE methods including, but not limited to, fluorescent dye penetrant, radiographic (film radiography, digital radiography, computed tomography), ultrasonic, neutron radiography, magnetic particle, eddy current, infrared thermography, and visual inspection. The Plan shall address how all NDE specifications and standards will be approved by the appropriate Government authority.
NDE Requirements During Hardware Design – The NDE Plan shall address how the processes are implemented to ensure that all designs are reviewed to establish NDE inspection requirements and to ensure that the parts are inspectable. The Plan shall address how the areas or zones of the part to be inspected are identified on the drawing. The Plan shall address how the operations and maintenance NDE requirements will be integrated in the design of the hardwate.
Part Classification – The Plan shall address appropriate spaceflight hardware and GSE part classification in accordance with MIL-HDBK-6870.
NDE Sensitivity Levels – NDE sensitivity levels shall be classified as Standard NDE, Special NDE, Custom NDE, and Visual Inspection in the NDE Plan. The Plan shall address minimum detectable flaw size for Standard NDE for each material group of spaceflight hardware in compliance with NASA-STD-5009 where applicable. The Plan shall address procedures for defining NDE acceptance criteria for each of the sensitivity levels and identify organizations and their responsibilities in establishing NDE acceptance criteria, NDE drawing call outs, and NDE Operations and Maintenance criteria. Note: Custom sensitivity level refers to an NDE sensitivity level that is not covered under the other three NDE sensitivity levels and is applicable to non-fracture-critical parts.
NDE Acceptance Criteria – The Plan shall address how NDE acceptance criteria are determined and implemented for each sensitivity level. For spaceflight hardware, the Plan shall require rejection of any crack-like flaw irrespective of the sensitivity level of the inspection. The Plan shall address how significant flaw indications, irrespective of the acceptance criteria, will be dispositioned.
NDE During Manufacturing –The Plan shall address establishment of minimum NDE acceptance requirements in terms of NDE sensitivity level, methods of inspection (fluorescent dye penetrant, ultrasonic, etc.), sampling frequency, and NDE inspection coverage (e.g., 100 percent surface area or selected area) for manufactured hardware as grouped by classification of the part, material type, and form. The NDE Plan shall address how NDE is sequenced such that inspection reliability is optimized by
NASA-STD-6016B
performing NDE before manufacturing processes that may significantly reduce flaw detection capability. The requirements for etching of metal parts prior to penetrant inspection shall be specifically addressed in the Plan.
NDE Material Compatibility – The Plan shall address compatibility of NDE materials and processes with the hardware.
Fracture-Critical Parts – The Plan shall address how the listing of all Fracture-Critical parts, created according to the Fracture Control Plan, will be integrated with NDE requirements. The Plan shall address Special NDE and Standard NDE methods in accordance with NASA-STD-5009.
NDE During Operations and Maintenance – The NDE Plan shall address the NDE requirements necessary to assure the health and integrity of the hardware throughout its life cycle. The NDE Plan shall address NDE requirements during operations and maintenance of those parts that are susceptible to damage, such as impact, corrosion, material degradation and wear, etc. The NDE Plan shall address NDE requirements for inspecting repaired parts. The Plan shall address the NDE procedures and physical standards required to perform the operations and maintenance NDE inspections.
NDE Reporting and Record Retention – The NDE Plan shall describe the NDE nonconformance reporting system, record retention, and traceability.
Process Audit – The Plan shall address periodic auditing of NDE processes at prime contractor, vendors, and subcontractors to verify compliance with the NDE requirements established in the Plan.
Personnel Training – The NDE Plan shall identify formal training and certification requirements for NDE Inspection in accordance with NAS 410, NAS Certification and Qualification of Nondestructive Test Personnel.
13.3
CONTENTS:
The Additively Manufactured Hardware Manufacturing and Qualification Plan shall address the following elements:
- a. Risk Classification of each AM part, based on consequence of failure, margin of safety, and build complexity.
- b. Development of Part Development Plans (PDP) to document the implementation and interpretation of the requirements for each AM part. [PDPs are configuration-controlled documents, enforced by each engineering drawing for an AM part to convey all process controls and requirements not within drawing notes.] The engineering drawing/PDP should address part classification and rationale; witness
NASA-STD-6016B
sampling requirements and acceptance criteria; thermal processing; first article evaluations and re-sampling periods; build orientation, platform material, and layout; special cleaning requirements; repair allowance; inspection requirements; critical dimensions; any other factors that affect physical/mechanical properties.
- c. Development of process controls on metallurgical process constituents, including the assembled part build file; feedstock controls; chemistry; powder feedstock (including recycled powder); fusion process controls (machine type and operating parameters: laser power, speed, layer thickness, hatch width, etc.); chamber atmosphere; chamber contamination control; and thermal processing controls.
- d. Controls on AM-related equipment, including addressing updates to improve machine performance.